Glass

ABSTRACT

A glass has a density of 2.60 g/cm 3  or lower, a Young&#39;s modulus of 88 GPa or more, a strain point of 650 to 720° C., a temperature T 4  at which a glass viscosity reaches 10 4  dPa·s of 1,320° C. or lower, a glass surface devitrification temperature (T c ) of T 4 +20° C. or lower, and an average coefficient of thermal expansion of 30×10 −7  to  43 ×10 −7 /° C. at 50 to 350° C. The glass contains, as represented by mol % based on oxides, 50 to 80% of SiO 2 , 8 to 20% of Al 2 O 3 , 0 to 0.5% in total of at least one kind of alkali metal oxide selected from the group consisting of Li 2 O, Na 2 O and K 2 O, and 0 to 1% of P 2 O 5 .

TECHNICAL FIELD

The present invention relates to a glass suitable as a glass substrate for various displays, photomasks, electronic device supports, information recording media, planar antennas, etc.

BACKGROUND ART

A glass to be used as a glass sheet (glass substrate) for various displays, photomasks, electronic device supports, information recording media, planar antennas, etc., particularly a glass to be used as a glass sheet on which a thin film of metal, oxide or the like should be formed on its surface is required to have the following characteristics (1) to (4) and so on.

(1) When the glass contains alkali metal oxide, the glass should contain substantially no alkali metal ion that may be diffused into the thin film to thereby deteriorate the film properties of the thin film. (2) The glass should have a strain point high enough to minimize deformation of the glass sheet and contraction (thermal contraction) caused by structural stabilization of the glass when the glass sheet is exposed to high temperature in a step of forming the thin film. (3) The glass should have enough chemical durability against various chemicals used for forming a semiconductor. Particularly the glass should have durability against alkali such as buffered hydrofluoric acid (BHF: liquid mixture of hydrofluoric acid and ammonium fluoride) used for etching SiO_(x) or SiN_(x), chemical liquid containing hydrochloric acid used for etching ITO, various acids (such as nitric acid, sulfuric acid, etc.) used for etching metal electrodes, and alkali of resist peeling liquid. (4) The glass should have no defects (bubbles, striae, inclusions, pits, scratches, etc.) inside the glass and in the surface of the glass.

In addition to the aforementioned requirements, the following characteristics are also required in recent years.

(5) The glass should have a small specific weight due to a request to reduce the weight of a display. (6) The glass sheet should be thinned due to the request to reduce the weight of the display. (7) The glass should have heat resistance to manufacture a polycrystal silicon (p-Si) type liquid crystal display high in heat treatment temperature as well as a conventional amorphous silicon (a-Si) type liquid crystal display (heat treatment temperature of a-Si: about 350° C., heat treatment temperature of p-Si: 350 to 550° C.). (8) The glass should have a small average coefficient of thermal expansion in order to increase a temperature increase/increase rate in thermal treatment for manufacturing the liquid crystal display to thereby increase the productivity or to increase the thermal shock resistance. On the other hand, when the average coefficient of thermal expansion of the glass is too small, the number of steps of forming various films such as a gate metal film and a gate insulating film in manufacturing of the liquid crystal display may increase to increase the warpage of the glass. Thus, defects such as cracks or scratches may occur when the liquid crystal display is being conveyed, causing a problem such as increase in misalignment of an exposure pattern. (9) The glass should have a high specific elastic modulus (Young's modulus/density) in accordance with increase in size and reduction in sheet thickness of the glass substrate.

In order to satisfy the aforementioned requirements, various glass compositions have been, for example, proposed in glasses for liquid crystal display panels (see Patent Literatures 1 to 4).

CITATION LIST Patent Literature Patent Literature 1: Japanese Patent No. 5702888 Patent Literature 2: WO 2013/183626 Patent Literature 3: Japanese Patent No. 5849965 Patent Literature 4: Japanese Patent No. 5712922 SUMMARY OF INVENTION Technical Problem

Resolution has been made higher and higher in recent electronic displays. In a large-sized television, for example, film thickness of Cu wiring has increased in accordance with higher definition thereof. For such a reason, warpage in a substrate tends to increase due to formation of various films. Therefore, to answer increasing needs for substrates with reduced warpage, it is necessary to increase the Young's modulus of a glass.

However, a known glass having a high Young's modulus as described in Patent Literature 3 or 4 has a high strain point and tends to have a high devitrification temperature as compared with a temperature T₄ at which viscosity reaches 10⁴ dPa·s. As a result, the glass cannot be formed easily, so that a load on manufacturing facilities increases. Thus, there is concern that the production cost may increase.

An object of the present invention is to provide a glass capable of inhibiting deformation such as warpage in a glass substrate, excellent in formability, low in load on manufacturing facilities, and easy to manufacture a large and thin glass substrate.

Solution to Problem

In order to attain the foregoing object, a glass according to the present invention has a density of 2.60 g/cm³ or lower, a Young's modulus of 88 GPa or more, a strain point of 650 to 720° C., a temperature T₄ at which a glass viscosity reaches 10⁴ dPa·s of 1,320° C. or lower, a glass surface devitrification temperature (T_(c)) of T₄+20° C. or lower, and an average coefficient of thermal expansion of 30×10⁻⁷ to 43×10⁻⁷/° C. at 50 to 350° C., and contains, as represented by mol % based on oxides, 50 to 80% of SiO₂, 8 to 20% of Al₂O₃, 0 to 0.5% in total of at least one kind of alkali metal oxide selected from the group consisting of Li₂O, Na₂O and K₂O, and 0 to 1% of P₂O₅.

In another configuration of the glass according to the present invention, specific elastic modulus may be 34 MN·m/kg or higher.

In another configuration of the glass according to the present invention, glass surface devitrification viscosity (η_(c)) may be 10^(3.8) dPa·s or higher.

In another configuration of the glass according to the present invention, a temperature T₂ at which the viscosity reaches 10² dPa·s may be 1,680° C. or lower.

In another configuration of the glass according to the present invention, a glass transition temperature may be 730 to 790° C.

In another configuration of the glass according to the present invention, the glass may contain, as represented by mol % based on oxides:

50 to 80% of SiO₂,

8 to 20% of Al₂O₃,

0 to 5% of B₂O₃,

0 to 15% of MgO,

0 to 12% of CaO,

0 to 10% of SrO,

0 to 10% of BaO,

0.005 to 0.2% of Na₂O,

0.001 to 0.5% of F,

0 to 1% of P₂O₅, and

0 to 0.5% in total of at least one kind of alkali metal oxide selected from the group consisting of Li₂O, Na₂O and K₂O,

wherein MgO+CaO+SrO+BaO is 18 to 22%.

In another configuration of the glass according to the present invention, the glass may contain, as represented by mol % based on oxides, 0.1 to 15% of MgO, and 1 to 12% of CaO, wherein MgO/CaO is 0.7 to 1.33.

In another configuration of the glass according to the present invention, a β-OH value may be 0.1 to 0.6 mm⁻¹.

In another configuration of the glass according to the present invention, a value expressed by the following Expression (I) may be 4.10 or more:

(7.87[Al₂O₃]−8.5[B₂O₃]+11.35[MgO]+7.09[CaO]+5.52[SrO]−1.45[BaO])/[SiO₂]  Expression (I)

In another configuration of the glass according to the present invention, a value expressed by the following Expression (II) may be 0.95 or more:

{−1.02[Al₂O₃]+10.79[B₂O₃]+2.84[MgO]+4.12[CaO]+5.19[SrO]+3.16[BaO]+11.07×([Li₂O]+[Na₂O]+[K₂O])+3.954[F]+5.677[β-OH]}/[SiO₂]  Expression (II)

In another configuration of the glass according to the present invention, a value expressed by the following Expression (III) may be 5.5 or less:

(8.9[Al₂O₃]+4.26[B₂O₃]+11.3[MgO]+4.54[CaO]+0.1[SrO]−9.98[BaO])×{1+([MgO]/[CaO]−1)²}/[SiO₂]  Expression (III)

In another configuration of the glass according to the present invention, the glass may contain 0.5% or lower of SnO₂ as represented by mol % based on oxides.

In another configuration of the glass according to the present invention, compaction may be 100 ppm or lower.

In another configuration of the glass according to the present invention, an equivalent cooling rate may be 5 to 500° C./min.

In another configuration of the glass according to the present invention, the glass may be a glass sheet having at least one side of 1,800 mm or longer and a thickness of 0.7 mm or less.

In another configuration of the glass according to the present invention, the glass may be manufactured by a float process or a fusion process.

A display panel according to the present invention includes a glass according to the present invention.

A semiconductor device according to the present invention includes a glass according to the present invention.

An information recording medium according to the present invention includes a glass according to the present invention.

A planar antenna according to the present invention includes a glass according to the present invention.

Advantageous Effects of Invention

According to the present invention, it is possible to provide a glass capable of inhibiting deformation such as warpage in a glass substrate, excellent in formability, low in load on manufacturing facilities, and easy to manufacture a large and thin glass substrate.

DESCRIPTION OF EMBODIMENT

An embodiment of the present invention is described below. The present invention is not limited to the embodiment which is described below.

In the following description, a composition range of each component of a glass is expressed by mol % based on oxides.

In the following description, a numerical range expressed by “numerical value A to numerical value B” designates a range including the numerical value A and the numerical value B as a minimum value and a maximum value of the range respectively, and means that the range is not less than the numerical value A and not more than the numerical value B.

First, a composition of a glass according to the embodiment is described.

When the content of SiO₂ is 50 mol % (hereinafter referred to as % simply) or lower, there is a tendency that the strain point of the glass does not increase sufficiently while the average coefficient of thermal expansion thereof increases and the specific weight thereof increases. Therefore, the content of SiO₂ is 50% or higher, preferably 62% or higher, more preferably 62.5% or higher, even more preferably 63% or higher, particularly preferably 63.5% or higher, and most preferably 64% or higher.

When the content of SiO₂ exceeds 80%, there is a tendency that the meltability of the glass decreases and the Young's modulus thereof decreases while the devitrification temperature thereof increases. Therefore, the content of SiO₂ is 80% or lower, preferably 70% or lower, more preferably 68% or lower, even more preferably 67% or lower, particularly preferably 66% or lower, and most preferably 65.7% or lower.

Al₂O₃ increases the Young's modulus to inhibit deflection, inhibits phase separation of the glass, decreases the average coefficient of thermal expansion, increases the strain point, and improves a fracture toughness value to increase glass strength. When the content of Al₂O₃ is lower than 8%, those effects do not appear easily. In addition, other components increasing the average coefficient of thermal expansion increase relatively. As a result, the average coefficient of thermal expansion tends to increase. Therefore, the content of Al₂O₃ is 8% or higher, preferably 10% or higher, more preferably 12% or higher, even more preferably 12.5% or higher, particularly preferably 12.8% or higher, and most preferably 13% or higher.

When the content of Al₂O₃ exceeds 20%, the meltability of the glass deteriorates and the devitrification temperature may increase. Therefore, the content of Al₂O₃ is 20% or lower, preferably 16.5% or lower, more preferably 16% or lower, even more preferably 15% or lower, particularly preferably 14.5% or lower, and most preferably 14% or lower.

B₂O₃ is not an essential component. However, B₂O₃ improves resistance to BHF, improves melting reaction of the glass and decreases the devitrification temperature. Therefore, B₂O₃ may be contained by 6% or lower. The content of B₂O₃ is 6% or lower, preferably 5% or lower, and more preferably 3% or lower.

Since B₂O₃ decreases the Young's modulus, the content of B₂O₃ is more preferably 2.5% or lower, further more preferably 2.2% or lower, even more preferably 2% or lower, particularly preferably 1.7% or lower, and most preferably 1.5% or lower.

MgO is not an essential component. However, MgO increases the Young's modulus without increasing the specific weight, so that MgO can increase the specific elastic modulus to thereby inhibit deflection. In addition, MgO improves the fracture toughness value to increase the glass strength. Therefore, MgO may be contained. Further, MgO also improves the meltability. When the content of MgO is lower than 1%, those effects do not appear easily. In addition, the coefficient of thermal expansion may be too low. Therefore, the content of MgO is preferably 1% or higher, more preferably 7% or higher, even more preferably 8% or higher, particularly preferably 8.2% or higher, and most preferably 8.5% or higher.

On the contrary, when the content of MgO is too high, the devitrification temperature tends to increase. Therefore, the content of MgO is preferably 15% or lower, more preferably 13% or lower, even more preferably 10% or lower, and particularly preferably 9.7% or lower.

CaO is not an essential component. However, CaO is characterized by increasing the specific elastic modulus next to MgO among alkali earth metals, and preventing the strain point from decreasing excessively. CaO also improves the meltability in the same manner as MgO. Therefore, CaO may be contained. Further, CaO is also characterized by making the devitrification temperature not higher than MgO does. When the content of CaO is lower than 1%, those effects do not appear easily. Therefore, the content of CaO is preferably 1% or higher, more preferably 6% or higher, even more preferably 7% or higher, particularly preferably 8% or higher, and most preferably 8.5% or higher.

When the content of CaO exceeds 12%, the average coefficient of thermal expansion becomes too high, and the devitrification temperature increases to devitrify the glass easily during the manufacturing of the glass. Therefore, the content of CaO is preferably 12% or lower, more preferably 10.5% or lower, and even more preferably 10% or lower.

SrO is not an essential component. However, SrO improves the meltability without increasing the devitrification temperature of the glass. Therefore, SrO may be contained. When the content of SrO is lower than 0.5%, those effects do not appear easily. Therefore, the content of SrO is preferably 0.5% or higher, more preferably 1% or higher, even more preferably 1.2% or higher, and particularly preferably 1.5% or higher.

The aforementioned effects in SrO are lower than those in BaO. When the content of SrO increases excessively, an effect of increasing the specific weight surpasses those effects, and the average coefficient of thermal expansion may also increase excessively. Therefore, the content of SrO is preferably 10% or lower, more preferably 4% or lower, even more preferably 3% or lower, and particularly preferably 2% or lower.

BaO is not an essential component. However, BaO improves the meltability without increasing the devitrification temperature of the glass. Therefore, BaO may be contained in the glass of this embodiment. However, when the content of BaO is excessive, there is a tendency that the specific weight increases, the Young's modulus decreases, and the average coefficient of thermal expansion increases excessively. Therefore, the content of BaO is preferably 10% or lower, and more preferably 0.5% or lower. Even more preferably in the glass in the embodiment, BaO is substantially not contained.

The phrase “substantially not contained” designates that a component is not contained but as impurities mixed from raw materials or the like, that is, not contained intentionally. In the embodiment, when BaO is substantially not contained, the content of BaO is, for example, 0.3% or lower, and preferably 0.2% or lower.

When the total content of alkali earth metal oxides, that is, MgO+CaO+SrO+BaO (hereinafter also referred to as “RO”) is low, the devitrification temperature increases, that is, the devitrification viscosity decreases, so that formability deteriorates. Therefore, RO is set at 18% or higher.

When RO is too rich, the average coefficient of thermal expansion may increase, and resistance to acid deteriorates. Therefore, RO is 22% or lower, preferably 20.7% or lower, and more preferably 20.5% or lower.

When MgO is 1% or higher and CaO is 1% or higher, a small proportion of the MgO content to the CaO content, that is, a small ratio MgO/CaO accelerates precipitation of CaO—Al₂O₃—SiO₂ based crystals to thereby deteriorate the formability. Specifically, the devitrification temperature increases, that is, the devitrification viscosity decreases. Therefore, MgO/CaO is 0.7 or higher, preferably 0.8 or higher, more preferably 0.85 or higher, even more preferably 0.9 or higher, and particularly preferably 0.92 or higher. However, when MgO/CaO is too high, MgO—Al₂O₃—SiO₂ based crystals are precipitated easily so that the devitrification temperature increases, that is, the devitrification viscosity decreases. Therefore, MgO/CaO is 1.33 or lower, preferably 1.3 or lower, more preferably 1.25 or lower, even more preferably 1.2% or lower, particularly preferably 1.1% or lower, most preferably 1.05% or lower.

The glass according to the embodiment contains alkali metal oxides from raw material impurities etc. unavoidably. In addition, a very small amount of alkali metal oxides may be contained in order to improve the meltability.

However, when the glass according to the embodiment is used as a TFT-side substrate of a flat panel display, an excessively high content of alkali metal oxides leads to conspicuous migration of alkali ions into TFT elements to thereby make transistor properties unstable or to lose reliability. It is therefore necessary to control the content of the alkali metal oxides within a moderate range.

In addition, when the glass according to the present invention is used as a semiconductor substrate, an excessively high content of alkali metal oxides may diffuse alkali ions to a substrate containing silicon in a heat treatment step in which the substrate containing silicon is pasted on the glass substrate.

Therefore, a total content of alkali metal oxides, that is, Li₂O+Na₂O+K₂O (hereinafter also referred to as “R′₂O”) is 0.5% or lower, preferably 0.2% or lower, more preferably 0.1% or lower, further more preferably 0.08% or lower, even more preferably 0.05% or lower, and most preferably 0.03% or lower.

Na₂O has an effect of decreasing the strain point of the glass. Therefore, Na₂O may be contained within a range where the aforementioned problems should not occur. IN order to obtain the effect of decreasing the strain point of the glass, the content of Na₂O is preferably 0.005% or higher, more preferably 0.01% or higher, particularly preferably 0.015% or higher, and most preferably 0.02% or higher.

However, when the content of Na₂O is high, the aforementioned problems may occur. Therefore, the content of Na₂O is preferably 0.5% or lower, more preferably 0.2% or lower, further more preferably 0.1% or lower, even more preferably 0.08% or lower, particularly preferably 0.05% or lower, and most preferably 0.03% or lower.

F is not an essential component. However, F has an effect of decreasing the strain point of the glass. Therefore, F may be contained. In order to obtain the effect of decreasing the strain point of the glass, the content of F is preferably 0.001% or higher, and more preferably 0.01% or higher. The upper limit of the content of F is not particularly limited, but it is preferably 1.5% or lower (0.43 mass % or lower), and more preferably 0.7% or lower.

When rich P₂O₅ is contained in the glass, water resistance of the glass deteriorates to easily generate striae. Thus, uniformity of the glass may deteriorate. In addition, when the glass is used as a display, rich P in the glass may cause a problem that a leak current occurs in TFT.

Therefore, the content of P₂O₅ is 1% or lower in the glass according to the embodiment. Preferably P₂O₅ is substantially not contained in the glass according to the present invention. In the embodiment, when P₂O₅ is substantially not contained, the content of P₂O₅ is, for example, 0.01% or lower, and preferably 0.005% or lower.

Further, in order to recycle the glass easily, it is preferable that PbO, As₂O₃ and Sb₂O₃ are substantially not contained in the glass according to the embodiment. In the embodiment, when PbO, As₂O₃ and Sb₂O₃ are substantially not contained, the content of each of PbO, As₂O₃ and Sb₂O₃ is, for example, 0.01% or lower, and preferably 0.005% or lower.

In order to improve the meltability, refining property, formability, etc. of the glass, the glass according to the embodiment may contain one or more kinds of ZrO₂, ZnO, Fe₂O₃, SO₃, Cl and SnO₂ by 2% or lower, preferably 1% or lower, and more preferably 0.5% or lower in total. Among them, the content of SnO₂ is preferably 0.5% or lower (1.1 mass % or lower) when SnO₂ is contained in order to improve the meltability and the refining property of the glass.

Moisture in the glass has an effect of decreasing the strain point of the glass. A β-OH value of the glass is used as an index of the amount of moisture contained in the glass. When the β-OH value of the glass is 0.1 to 0.6 mm⁻¹, the strain point of the glass can be decreased suitably. When the β-OH value exceeds 0.6 mm⁻¹, generation of bubbles at an interface with platinum cannot be inhibited. The bubbles at the interface with platinum are generated in such a manner that H₂ passing through a wall surface of a molten glass flow channel made of a platinum material reacts with moisture in molten glass to thereby generate 02. The β-OH value of the glass is more preferably 0.15 to 0.6 mm⁻¹, furthermore preferably 0.2 to 0.45 mm⁻¹, even more preferably 0.22 to 0.35 mm⁻¹, and further even more particularly preferably 0.25 to 0.3 mm⁻¹.

The β-OH value of the glass can be adjusted by various conditions during melting of glass raw materials, such as the amount of moisture in the glass raw materials, vapor concentration in a dissolver, dwell time of a glass melt in the dissolver, etc.

As a method for adjusting the amount of moisture in glass raw materials, there is a method using hydroxide in place of oxide as a glass raw material (for example, using magnesium hydroxide (Mg(OH)₂) in place of magnesium oxide (MgO) as a magnesium source).

As a method for adjusting the vapor concentration in the dissolver, there is a method using oxygen in place of the air for combustion of fuel such as town gas or heavy oil in order to heat the dissolver, or a method using a gas mixture of oxygen and the air likewise.

In the glass according to the embodiment, a value expressed by the following Expression (I) is preferably 4.10 or more.

(7.87[Al₂O₃]−8.5[B₂O₃]+11.35[MgO]+7.09[CaO]+5.52[SrO]−1.45[BaO])/[SiO₂]  Expression (I)

The value expressed by Expression (I) is an index of the Young's modulus. When the value is less than 4.10, the Young's modulus is reduced. In the glass according to the embodiment, the value expressed by Expression (I) is more preferably 4.15 or more, even more preferably 4.20 or more, particularly preferably 4.25 or more, and most preferably 4.30 or more.

In the aforementioned Expression (I), [Al₂O₃], [B₂O₃], [MgO], [CaO], [SrO], [BaO] and [SiO₂] represent the contents of Al₂O₃, B₂O₃, MgO, CaO, SrO, BaO and SiO₂ as represented by mol % based on oxides, respectively. The same thing can be applied to the following Expressions (II) and (III).

In the glass according to the embodiment, a value expressed by the following Expression (II) is preferably 0.95 or more.

{−1.02[Al₂O₃]+10.79[B₂O₃]+2.84[MgO]+4.12[CaO]+5.19[SrO]+3.16[BaO]+11.07×([Li₂O]+[Na₂O]+[K₂O])+3.954[F]+5.677[β-OH]}/[SiO₂]  Expression (II)

The value expressed by Expression (II) is an index of the strain point. When the value is less than 0.95, the strain point is increased. In the glass according to the embodiment, the value expressed by Expression (II) is more preferably 1.0 or more, even more preferably 1.05 or more, and particularly preferably 1.10 or more.

In the aforementioned Expression (II), [Li₂O], [Na₂O], [K₂O] and [F] represent the contents of Li₂O, Na₂O, K₂O and F as represented by mol % based on oxides, respectively.

In the aforementioned Expression (II), [β-OH] represents the β-OH value by mm⁻¹ unit.

In the glass according to the embodiment, a value expressed by the following Expression (III) is preferably 5.5 or less.

(8.9[Al₂O₃]+4.26[B₂O₃]+11.3[MgO]+4.54[CaO]+0.1[SrO]−9.98[BaO])×{1+([MgO]/[CaO]−1)²}/[SiO₂]  Expression (III)

The value expressed by Expression (III) is an index of the devitrification viscosity. When the value exceeds 5.5, the devitrification viscosity is reduced. In the glass according to the embodiment, the value expressed by Expression (III) is more preferably 5.1 or less, even more preferably 4.8 or less, particularly preferably 4.5 or less, and most preferably 4.30 or less.

The Young's modulus of the glass according to the embodiment is 88 GPa or more. Consequently, deformation of a substrate caused by external stress can be inhibited. For example, in manufacturing of a TFT-side substrate of a flat panel display, the substrate can be inhibited from warping when a gate metal film of copper or the like or a gate insulating film of silicon nitride or the like is formed on the surface of the substrate. Deflection of the substrate can be also inhibited. The Young's modulus is preferably 88.5 GPa or more, more preferably 89 GPa or more, even more preferably 89.5 GPa or more, particularly preferably 90 GPa or more, and most preferably 90.5 GPa or more. The Young's modulus can be measured by an ultrasonic method.

The density of the glass according to the embodiment is 2.60 g/cm³ or lower. Consequently, the glass has a reduced deflection by its own weight so that the glass can be handled easily even if it is formed into a large-sized substrate. In addition, a device using the glass according to the embodiment can be reduced in weight. The density is more preferably 2.59 g/cm³ or lower, even more preferably 2.58 g/cm³ or lower, particularly preferably 2.57 g/cm³ or lower, and most preferably 2.56 g/cm³ or lower. The large-sized substrate is, for example, a substrate having at least one side of 1,800 mm or longer. At least one side of the large-sized substrate may be 2,000 mm or longer, or 2,500 mm or longer, 3,000 mm or longer, or 3,500 mm or longer.

The strain point of the glass according to the embodiment is 650 to 720° C. When the strain point is lower than 650° C., a glass sheet exposed to high temperature in a step of forming a thin film on a display tends to be deformed and contracted (thermally contracted) due to structural stabilization of the glass. The strain point is preferably 685° C. or higher, more preferably 690° C. or higher, even more preferably 693° C. or higher, particularly preferably 695° C. or higher, and most preferably 698° C. or higher. On the other hand, when the strain point is too high, it is necessary to increase the temperature of a slow cooling apparatus in accordance with the strain point. Thus, the life of the slow cooling apparatus tends to be reduced. In addition, the glass cannot be formed easily. Thus, a deviation in sheet thickness or waving in the surface may increase. The strain point is preferably 718° C. or lower, more preferably 716° C. or lower, even more preferably 714° C. or lower, particularly preferably 712° C. or lower, and most preferably 710° C. or lower.

In the glass according to the embodiment, a temperature T₄ at which the viscosity reaches 10⁴ dPa·s is 1,320° C. or lower. Consequently, the glass according to the embodiment is excellent in formability. In addition, a load on manufacturing facilities can be reduced. For example, the life of a float bath or the like for forming the glass can be elongated so that productivity can be improved. T₄ is preferably 1,300° C. or lower, more preferably 1,290° C. or lower, even more preferably 1,285° C. or lower, and particularly preferably 1,280° C. or lower.

T₄ can be obtained as a temperature at which viscosity measured by use of a rotary viscometer reaches 10⁴ dPa·s according to a method specified under ASTM C 965-96. In Examples which are described later, NBS710 and NIST717a were used as reference samples for calibration of apparatus.

In the glass according to the embodiment, a glass surface devitrification temperature (T_(c)) is T₄+20° C. or lower. Consequently, the glass according to the embodiment is excellent in formability. In addition, transmittance can be inhibited from decreasing due to crystals generated inside the glass during forming. In addition, a load on manufacturing facilities can be reduced. For example, the life of afloat bath or the like for forming the glass can be elongated so that productivity can be improved.

The glass surface devitrification temperature (T_(c)) is preferably T₄+10° C. or lower, more preferably T₄+5° C. or lower, even more preferably T₄° C. or lower, particularly preferably T₄-1° C. or lower, and most preferably T₄−5° C. or lower.

The glass surface devitrification temperature (T_(c)) and a glass internal devitrification temperature (T_(d)) can be obtained as follows. That is, crushed glass particles are put into a dish made of platinum, and a heat treatment is performed thereon for 17 hours in an electric furnace controlled to a fixed temperature. After the heat treatment, a maximum temperature at which crystals are precipitated on the surface of the glass and a minimum temperature at which no crystals are precipitated likewise are measured by use of an optical microscope, and an average of those temperatures is regarded as the glass surface devitrification temperature (T_(c)). In the same manner, a maximum temperature at which crystals are precipitated inside the glass and a minimum temperature at which no crystals are precipitated likewise are measured, and an average of those temperatures is regarded as the glass internal devitrification temperature (T_(d)). Viscosity in each of the glass surface devitrification temperature (T_(c)) and a glass internal devitrification temperature (T_(d)) can be obtained by viscosity of the glass measured at the devitrification temperature.

In the glass according to the embodiment, the average coefficient of thermal expansion at 50 to 350° C. is 30×10⁻⁷/° C. or higher. For example, in manufacturing of a TFT-side substrate of a flat panel display, a gate metal film of copper or the like and a gate insulating film of silicon nitride or the like may be laminated sequentially on the glass. In this case, when the average coefficient of thermal expansion at 50 to 350° C. is lower than 30×10⁻⁷/° C., the difference in thermal expansion between the glass and the gate metal film of copper or the like formed on the surface of the substrate increases so that there may arise such a problem that the substrate is warped or the film is separated.

The average coefficient of thermal expansion at 50 to 350° C. is preferably 33×10⁻⁷/° C. or higher, more preferably 35×10⁻⁷/° C. or higher, even more preferably 36×10⁻⁷/° C. or higher, particularly preferably 37×10⁻⁷/° C. or higher, and most preferably 38×10⁻⁷/° C. or higher.

On the other hand, when the average coefficient of thermal expansion at 50 to 350° C. is higher than 43×10⁻⁷/° C., the glass may be cracked in a step of manufacturing a product such as a display. Therefore, the average coefficient of thermal expansion at 50 to 350° C. is 43×10⁻⁷/° C. or lower.

The average coefficient of thermal expansion at 50 to 350° C. is preferably 42×10⁻⁷/° C. or lower, more preferably 41.5×10⁻⁷/° C. or lower, even more preferably 41×10⁻⁷/° C. or lower, particularly preferably 40.5×10⁻⁷/° C. or lower, and most preferably 40.3×10⁻⁷/° C. or lower.

The specific elastic modulus (Young's modulus (GPa)/density (g/cm³) of the glass according to the embodiment is preferably 34 MN·m/kg or higher. Consequently the glass has a reduced deflection by its own weight so that the glass can be handled easily even if it is formed into a large-sized substrate. The specific elastic modulus is more preferably 34.5 MN·m/kg or higher, even more preferably 34.8 MN·m/kg or higher, particularly preferably 35 MN·m/kg or higher, and most preferably 35.2 MN·m/kg or higher.

In the glass according to the embodiment, glass surface devitrification viscosity (η_(c)) which is viscosity at the glass surface devitrification temperature (T_(c)) is preferably 10^(3.8) dPa·s or higher. Consequently the glass is excellent in formability into a glass sheet. In addition, transmittance can be inhibited from decreasing due to crystals generated inside the glass during forming. In addition, a load on manufacturing facilities can be reduced. For example, the life of a float bath or the like for forming the glass can be elongated so that productivity can be improved. The glass surface devitrification viscosity (11c) is more preferably 10^(3.85) dPa·s or higher, even more preferably 10^(3.9) dPa·s or higher, particularly preferably 10⁴ dPa·s or higher, and most preferably 10^(4.05) dPa·s or higher,

A temperature T₂ at which the viscosity of the glass according to the embodiment reaches 10² dPa·s is preferably 1,680° C. or lower. Consequently the glass is excellent in meltability. In addition, a load on manufacturing facilities can be reduced. For example, the life of a furnace or the like for melting the glass can be elongated so that productivity can be improved. In addition, defects (such as spot defects or Zr defects) caused by the furnace can be reduced. T₂ is more preferably 1,670° C. or lower, and even more preferably 1,660° C. or lower.

A glass transition temperature of the glass according to the embodiment is preferably 730 to 790° C. When the glass transition temperature is 730° C. or higher, the glass is excellent in formability. For example, a deviation in sheet thickness or waving in the surface can be reduced. On the other hand, when the strain point is 790° C. or lower, a load on manufacturing facilities can be reduced. For example, a surface temperature of a roll used for forming the glass can be reduced so that the life of facilities can be elongated, and the productivity can be improved. The glass transition temperature is more preferably 740° C. or higher, even more preferably 745° C. or higher, particularly preferably 750° C. or higher, and most preferably 755° C. or higher. On the other hand, the glass transition temperature is more preferably 785° C. or lower, even more preferably 783° C. or lower, particularly preferably 780° C. or lower, and most preferably 775° C. or lower.

In the glass according to the embodiment, compaction is preferably 100 ppm or lower, more preferably 90 ppm or lower, further more preferably 80 ppm or lower, even more preferably 75 ppm or lower, particularly preferably 70 ppm or lower, and most preferably 65 ppm or lower. The compaction is a glass thermal shrinkage generated by relaxation of a glass structure during a heat treatment. When the compaction is 100 ppm or lower, deformation of the glass and a dimensional change caused by structural stabilization of the glass can be suppressed and minimized when the glass is exposed to high temperature in a thin film forming step carried out in a process of manufacturing various displays.

The compaction in the embodiment means compaction measured in the following procedure.

A glass sheet sample (sample mirror-finished with cerium oxide and measuring 100 mm in length, 10 mm in width and 1 mm in thickness) obtained by processing the glass according to the embodiment is retained at a temperature of the glass transition temperature +120° C. for 5 minutes, and then cooled down to room temperature at a rate of 40° C. per minute. After the glass sheet sample has been cooled down to the room temperature, total length (lengthwise) L1 of the sample is measured. After that, the glass sheet sample is heated to 600° C. at a rate of 100° C. per hour, retained at 600° C. for 80 minutes, and cooled down to the room temperature at a rate of 100° C. per hour. After the glass sheet sample has been cooled down to the room temperature, total length L2 of the sample is measured again. A ratio (L1−L2)/L1 of a difference (L1−L2) in total length between before and after the heat treatment at 600° C. to the total length L1 of the sample before the heat treatment at 600° C. is regarded as a value of compaction.

In the glass according to the embodiment, for example, an equivalent cooling rate is set preferably at 500° C./min or lower in order to reduce the compaction. The equivalent cooling rate is preferably 5° C./min or higher and 500° C./min or lower in terms of balance between the compaction and the productivity. In terms of the productivity, the equivalent cooling rate is more preferably 10° C./min or higher, even more preferably 15° C./min or higher, particularly preferably 20° C./min or higher, and most preferably 25° C./min or higher. In terms of the compaction, the equivalent cooling rate is more preferably 300° C./min or lower, even more preferably 200° C./min or lower, particularly preferably 150° C./min or lower, and most preferably 100° C./min or lower.

The equivalent cooling rate in the embodiment means an equivalent cooling rate measured in the following procedure.

The glass according to the embodiment is processed to obtain a plurality of samples for creating a calibration curve. Each sample has a rectangular parallelepiped shape measuring 10 mm by 10 mm by 1 mm. The samples prepared thus are retained for 5 minutes at the glass transition temperature +120° C. by use of an infrared heating electric furnace. After that, each sample is cooled down to 25° C. at a different cooling rate ranging from 1° C./min to 1,000° C./min. Next, a refractive index n_(d) on d-line (wavelength 587.6 nm) is measured in each sample by a V-block method using a precision refractometer KPR-2000 made by Shimadzu Device Corporation. The value n_(d) obtained in each sample is plotted for a logarithm of the cooling rate thereof. In this manner, a calibration curve of n_(d) for the cooling rate is obtained.

Next, the glass according to the embodiment is processed into a rectangular parallelepiped shape measuring 10 mm by 10 mm by 1 mm, and n_(d) is measured by the V-block method using the precision refractometer KPR-2000 made by Shimadzu Device Corporation. A cooling rate corresponding to the obtained n_(d) is acquired from the calibration curve. The obtained cooling rate is regarded as the equivalent cooling rate.

The glass according to the embodiment has a high Young's modulus of 88 GPa or higher to thereby inhibit deformation of a substrate caused by external stress. Thus, the glass is suitable for a glass sheet to be used as a large-sized substrate. The large-sized substrate is, for example, a glass sheet having at least one side of 1,800 mm or longer. As a specific example, the substrate is a glass sheet which is 1,800 mm or longer in long sides and 1,500 mm or longer in short sides.

The glass according to the embodiment is used preferably as a glass sheet which has at least one side of 2,400 mm or longer, for example, which is 2,400 mm or longer in long sides and 2,100 mm or longer in short sides, more preferably as a glass sheet which has at least one side of 3,000 mm or longer, for example, which is 3,000 mm or longer in long sides and 2,800 mm or longer in short sides, particularly preferably as a glass sheet which has at least one side of 3,200 mm or longer, for example, which is 3,200 mm or longer in long sides and 2,900 mm or longer in short sides, and most preferably as a glass sheet which has at least one side of 3,300 mm or longer, for example, which is 3,300 mm or longer in long sides and 2,950 mm or longer in short sides.

The glass according to the embodiment is preferably 0.7 mm or less in thickness in terms of reduction in weight. The thickness of the glass according to the embodiment is more preferably 0.65 mm or less, even more preferably 0.55 mm or less, particularly preferably 0.45 mm or less, and most preferably 0.4 mm or less. Although the thickness may be set at 0.1 mm or less or 0.05 mm or less, the thickness is preferably 0.1 mm or more and more preferably 0.2 mm or more in terms of prevention of deflection by its own weight.

The glass according to the embodiment can be, for example, manufactured in the following procedure.

Raw materials for the glass are prepared to have an intended glass composition, thrown into a melting furnace, and heated to 1,500 to 1,800° C. to be thereby melted. Thus, a molten glass is obtained. The obtained molten glass is formed into a glass ribbon with a predetermined sheet thickness by a forming apparatus. The glass ribbon is gradually cooled down, and then cut. Thus, the glass is obtained.

In the manufacturing of the glass according to the embodiment, it is preferable that the glass is, for example, cooled down to set the equivalent cooling rate at 500° C./min or lower in order to reduce the compaction.

In the manufacturing of the glass according to the embodiment, it is preferable that the molten glass is formed into a glass sheet by a float process, a fusion process or the like. The float process is preferred in order to stably produce a large-sized sheet glass (for example, having one side of 1,800 mm or longer) with a high Young's modulus.

Next, a display panel according to the embodiment is described.

The display panel according to the embodiment includes the aforementioned glass according to the embodiment as a glass substrate. The display panel is not particularly limited as long as it includes the glass according to the embodiment. The display panel may be one of various display panels such as a liquid crystal display panel, an organic EL display panel, etc.

Description is made in a case of a thin film transistor liquid crystal display (TFT-LCD) by way of example. A gate electrode line and a gate insulating oxide layer are formed on the surface of the display. A display surface electrode substrate (array substrate) where pixel electrodes are formed and a color filter substrate where RGB color filters and opposed electrodes are formed are provided on the surface of the oxide layer. A liquid crystal material is put between the array substrate and the color filter substrate which are paired. In this manner, a cell is constituted. A liquid crystal display panel includes not only the cell but also other elements such as a peripheral circuit and so on. In the liquid crystal display panel according to the embodiment, the glass according to the embodiment is used as at least one of the paired substrates constituting the cell.

The glass according to the embodiment can be used as a glass sheet for supporting an electronic device. When the glass according to the embodiment is used as a glass sheet for supporting an electronic device, a device forming substrate such as a glass substrate, a silicon substrate or a resin substrate is laminated on the glass (glass sheet for supporting an electronic device) according to the embodiment directly or by use of a bonding material so that the device forming substrate can be supported. Examples of the glass sheet for supporting an electronic device include a supporting glass sheet in a process of manufacturing a flexible display (such as an organic EL display) using resin such as polyimide as a substrate, and a glass sheet for supporting a resin-silicon chip composite wafer in a process of manufacturing a semiconductor package.

Next, a semiconductor device according to the embodiment is described.

The semiconductor device according to the embodiment includes the aforementioned glass according to the embodiment as a glass substrate. Specifically the semiconductor device according to the embodiment includes the glass according to the embodiment as a glass substrate for an image sensor such as MEMS, CMOS or CIS. The semiconductor device according to the embodiment includes the glass according to the embodiment as a cover glass for a display device for a projection application, such as a cover Glass for LCOS (Liquid Crystal on Silicon).

Next, an information recording medium according to the embodiment is described.

The information recording medium according to the embodiment includes the aforementioned glass according to the embodiment as a glass substrate. Specifically, examples of the information recording medium include a magnetic recording medium, an optical disk, etc. Examples of the magnetic recording medium include an energy-assisted magnetic recording medium and a vertical magnetic recording type magnetic recording medium.

Next, a planar antenna according to the embodiment is described.

The planar antenna according to the embodiment includes the aforementioned glass according to the embodiment as a glass substrate. Specifically, examples of the planar antenna include a plane liquid crystal antenna having a planar shape, such as a liquid crystal antenna or a microstrip antenna (patch antenna) as an antenna excellent in directivity and receiving sensitivity. Such a liquid crystal antenna is, for example, disclosed in WO 2018/016398. Such a patch antenna is, for example, disclosed in JP-T-2017-509266 or JP-A-2017-063255.

EXAMPLES

Examples is described below, but the present invention is not limited to those examples. In the following description, Examples 1 to 22 and Examples 29 to 49 are working examples, and Examples 23 to 28 are comparative examples.

Raw materials for respective components were prepared to obtain each composition (unit: mol %) shown in Tables 1 to 7, and melted at 1,600° C. for 1 hour by use of a platinum crucible. After the melting, the obtained melt was poured onto a carbon plate, retained for 60 minutes at a temperature of the glass transition temperature +30° C., and cooled down to room temperature (25° C.) at a rate of 1° C. per minute. Thus, a sheet-like glass was obtained. The sheet-like glass was mirror-finished to obtain a glass sheet, various physical properties of which were measured. Results are shown in Tables 1 to 7. In Tables 1 to 7, each value in parenthesis is a calculated value, and each black designates an unmeasured item.

Methods for measuring the respective physical properties are shown below. (β-OH value of glass)

For each glass sample, absorbance against a light of a wavelength of 2.75 to 2.95 m was measured, and a maximum value β_(max) of the measured absorbance was divided by the thickness (mm) of the sample. Thus, the β-OH value of the glass was obtained.

(Average Coefficient of Thermal Expansion)

Measurement was performed by use of a differential thermal expansion meter (TMA) according to a method specified under JIS R3102 (1995). A measuring temperature range was set as a range of from room temperature to 400° C. or higher, and an average coefficient of thermal expansion at 50 to 350° C. was expressed by unit of 10⁻⁷/° C.

(Density)

Density of about 20 g of a glass block including no bubbles was measured by an Archimedes method according to a method specified under JIS Z 8807.

(Strain Point)

A strain point was measured by a fiber drawing method according to a method specified under JIS R3103-2 (2001).

(Glass Transition Temperature Tg)

A glass transition temperature Tg was measured by a thermal expansion method using a differential dilatometer (TMA) according to a method specified under JIS R3103-3 (2001).

(Young's Modulus)

Young's modulus was measured for a glass 0.5 to 10 mm thick by an ultrasonic method according to a method specified under JIS Z 2280.

(T₂)

Viscosity was measured by use of a rotary viscometer, and a temperature T₂ (° C.) at which the viscosity reached 10² d·Pa·s was measured according to a method specified under ASTM C 965-96.

(T₄)

Viscosity was measured by use of a rotary viscometer, and a temperature T₄ (° C.) at which the viscosity reached 10⁴ d-Pa-s was measured according to a method specified under ASTM C 965-96.

(Devitrification Temperature)

Each glass was crushed and classified into a particle size range of 2 to 4 mm by use of testing sieves.

A glass cullet obtained thus was ultrasonically cleaned in isopropyl alcohol for 5 minutes, washed with ion-exchanged water, then dried, put into a dish made of platinum, and subjected to a heat treatment for 17 hours in an electric furnace controlled to a fixed temperature. The temperature of the heat treatment was set stepwise at an interval of 10° C. After the heat treatment, the glass was extracted from the platinum dish. Maximum temperatures at which crystals were precipitated on the surface of the glass and inside the glass and minimum temperatures at which no crystals were precipitated likewise were measured by use of an optical microscope. Each of the maximum temperatures at which crystals were deposited on the surface of the glass and inside the glass and the minimum temperatures at which no crystals were deposited likewise was measured once (or twice when precipitation of crystals could not be determined easily). An average value of the maximum temperature at which crystals were deposited on the surface of the glass and the minimum temperature at which no crystals were deposited likewise was obtained and regarded as a glass surface devitrification temperature (T_(c)). In the same manner, an average value of the maximum temperature at which crystals were deposited inside the glass and the minimum temperature at which no crystals were deposited likewise was obtained and regarded as a glass internal devitrification temperature (T_(d)).

(Specific Elastic Modulus)

The Young's modulus obtained in the aforementioned procedure was divided by the density. Thus, specific elastic modulus was obtained.

(Devitrification Viscosity)

The glass surface devitrification temperature (T_(c)) was obtained in the aforementioned method, and viscosity of the glass at the glass surface devitrification temperature (T_(c)) was measured and regarded as glass surface devitrification viscosity (η_(c)). In the same manner, the glass internal devitrification temperature (T_(d)) was obtained, and viscosity of the glass at the glass internal devitrification temperature (T_(d)) was measured and regarded as glass internal devitrification viscosity (η_(d)).

TABLE 1 Ex1 Ex2 Ex3 Ex4 Ex5 Ex6 Ex7 SiO₂ 65.1  65.2  65.2  65.2  65.2  65.2  64.8  Al₂O₃ 13.5  13.5  13.5  13.8  13.8  13.8  14.2  B₂O₃ 1.2  1.2  1.2  1.2  1.2  1.2  1.2  MgO 9.5  9.2  8.9  8.9  9.2  8.6  9.0  CaO 10.0  9.7  9.4  9.4  9.1  9.7  9.0  SrO 0.6  1.2  1.8  1.5  1.5  1.5  1.8  BaO 0   0   0   0   0   0   0   Li₂O 0   0   0   0   0   0   0   Na₂O 0.08 0.02 0.02 0.02 0.02 0.02 0.02 K₂O 0   0   0   0   0   0   0   F 0.13 0.06 0.06 0.06 0.06 0.06 0.06 P₂O₅ 0   0   0   0   0   0   0   SnO₂ 0   0   0   0   0   0   0   β-OH [/mm] 0.25 0.25 0.25 0.25 0.25 0.25 0.25 R₂O 0.08 0.02 0.02 0.02 0.02 0.02 0.02 RO 20.1  20.1  20.1  19.8  19.8  19.8  19.8  MgO/CaO 0.95 0.95 0.95 0.95 1.01 0.89 1.00 Value of Expression (I) 4.27 4.23 4.20 4.21 4.23 4.19 4.28 Value of Expression (II) 1.13 1.13 1.14 1.11 1.11 1.12 1.12 Value of Expression (III) 4.28 4.20 4.13 4.17 4.19 4.18 4.23 Average coefficient of thermal 39.0  39.6  40.2  39.8  39.8  40.0  39.6  expansion (×10⁻⁷/° C.) Density (g/cm³) 2.54 2.55 2.56 2.55 2.55 2.55 2.56 Strain point (° C.) (715)    712    715    718    717    716    715    Glass transition temperature 781    768    768    770    771    770    770    (° C.) Young's modulus (GPa) 91.3  92.0  90.8  90.3  90.3  90.1  90.0  T₂ (° C.) 1611     1616     1617     1610     1610     1610     1611     T₄ (° C.) 1276     1279     1279     1276     1276     1276     1277     T_(c) (° C.) 1275     1275     1265     1275     1265     1275     1285     T_(d) (° C.) <1270     <1270     <1260     <1260     <1260     1265     <1280     η_(c)(dPa · s) 10^(4.01)  10^(4.03)  10^(4.12)  10^(4.01)  10^(4.10)  10^(4.01)  10^(3.94)  η_(d)(dPa · s) >10^(4.05)  >10^(4.07)  >10^(4.16)  >10^(4.14)  >10^(4.14)  10^(4.09)  >10^(3.98)  Specific elastic modulus 35.9  36.0  35.4  35.4  35.4  35.3  35.1  (MNm/kg) Equivalent cooling rate 40    40    40    40    40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)     (≤100)     (≤100)     (≤100)     (≤100)    

TABLE 2 Ex8 Ex9 Ex10 Ex11 Ex12 Ex13 Ex14 SiO₂ 64.8  63.2  63.2  65.1  65.1  67.5  67.5  Al₂O₃ 14.2  15.5  15.5  13.5  13.5  13.4  13.4  B₂O₃ 1.2  1.2  1.2  1.2  1.2  1.2  1.2  MgO 8.6  10.0  9.2  9.5  10.1  9.5  7.6  CaO 9.4  8.3  9.1  8.8  8.2  6.4  8.3  SrO 1.8  1.8  1.8  1.8  1.8  1.8  1.8  BaO 0   0   0   0   0   0   0   Li₂O 0   0   0   0   0   0   0   Na₂O 0.02 0.08 0.08 0.08 0.08 0.08 0.08 K₂O 0   0   0   0   0   0   0   F 0.06 0.06 0.06 0.13 0.13 0.13 0.13 P₂O₅ 0   0   0   0   0   0   0   SnO₂ 0   0   0   0   0   0   0   β-OH [/mm] 0.25 0.25 0.25 0.32 0.32 0.32 0.32 R₂O 0.02 0.08 0.08 0.08 0.08 0.08 0.08 RO 19.8  20.1  20.1  20.1  20.1  17.7  17.7  MgO/CaO 0.91 1.20 1.01 1.08 1.23 1.48 0.92 Value of Expression (I) 4.26 4.65 4.60 4.24 4.28 3.83 3.71 Value of Expression (II) 1.12 1.13 1.15 1.15 1.14 0.97 1.00 Value of Expression (III) 4.22 4.85 4.57 4.22 4.48 4.77 3.70 Average coefficient of thermal 40.2  39.5  40.1  40.5  39.5  36.3  37.4  expansion (×10⁻⁷/° C.) Density (g/cm³) 2.56 2.58 2.58 2.56 2.56 2.53 2.53 Strain point (° C.) 716    (716)    (716)    (711)    (716)    (716)    (716)    Glass transition temperature 772    (770)    (770)    (771)    (767)    (783)    (763)    (° C.) Young's modulus (GPa) 89.7  91.5  91.6  89.7997    90.3  89.2  88.9  T₂ (° C.) 1610     1577     1583     1613     1613     1664     1665     T₄ (° C.) 1278     1258     1263     1276     1276     1312     1313     T_(c) (° C.) 1275     1265     1275     1265     1265     1295     1255     T_(d) (° C.) <1270     <1260     <1260     <1260     <1250     <1280     <1250     η_(c)(dPa · s) 10^(4.02)  10^(3.94)  10^(3.90)  10^(4.09)  10^(4.09)  10^(4.14)  10^(4.48)  η_(d)(dPa · s) >10^(4.06)  >10^(3.99)  >10^(4.03)  10^(4.13)  10^(4.13)  10^(4.27)  10^(4.53)  Specific elastic modulus 35.0  35.5  35.5  35.1  35.3  35.3  35.1  (MNm/kg) Equivalent cooling rate 40    40    40    40    40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)     (≤100)     (≤100)     43    39   

TABLE 3 Ex15 Ex16 Ex17 Ex18 SiO₂ 65.2  65.1  65.1  65.1  Al₂O₃ 13.5  13.5  13.5  13.8  B₂O₃ 1.2  1.2  1.2  1.2  MgO 8.5  9.2  8.9  8.9  CaO 11.0  9.7  9.4  9.4  SrO 0.6  1.2  1.8  1.5  BaO 0   0   0   0   Li₂O 0   0   0   0   Na₂O 0.08 0.08 0.08 0.08 K₂O 0   0   0   0   F 0.13 0.13 0.13 0.13 P₂O₅ 0   0   0   0   SnO₂ 0   0   0   0   β-OH [/mm] 0.32 0.25 0.25 0.25 R2O 0.08 0.08 0.08 0.08 RO 20.1  20.1  20.1  19.8  MgO/CaO 0.77 0.95 0.95 0.95 Value of Expression (I) 4.20 4.24 4.20 4.21 Value of Expression (II) 1.15 1.14 1.16 1.13 Value of Expression (III) 4.38 4.21 4.14 4.18 Average coefficient of 40.5  (39.6)  (40.2)  (39.8)  thermal expansion (×10⁻⁷/° C.) Density (g/cm³) 2.55 (2.55) (2.56) (2.55) Strain point (° C.) (718)    (706)    (709)    (708)    Glass transition (770)    (761)    (761)    (763)    temperature (° C.) Young's modulus (GPa) 92.0  (92)    (91)    (90)    T₂ (° C.) 1616     (1616)     (1617)     (1610)     T₄ (° C.) 1276     (1279)     (1279)     (1276)     T_(c) (° C.) 1285     (1275)     (1265)     (1275)     T_(d) (° C.) <1280     (<1270)     (<1260)     (<1260)     η_(c)(dPa · s) 10^(3.93)  (10^(4.03))  (10^(4.12))  (10^(4.01))  η_(d)(dPa · s) >10^(3.97)  (>10^(4.07))  (>10^(4.16))  (>10^(4.14))  Specific elastic modulus 36.1  (36.0)  (35.4)  (35.4)  (MNm/kg) Equivalent cooling rate 40    40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)     (≤100)     Ex19 Ex20 Ex21 SiO₂ 65.1  65.1  64.7  Al₂O₃ 13.8  13.8  14.2  B₂O₃ 1.2  1.2  1.2  MgO 9.2  8.6  9.0  CaO 9.1  9.7  9.0  SrO 1.5  1.5  1.8  BaO 0   0   0   Li₂O 0   0   0   Na₂O 0.08 0.08 0.08 K₂O 0   0   0   F 0.13 0.13 0.13 P₂O₅ 0   0   0   SnO₂ 0   0   0   β-OH [/mm] 0.25 0.25 0.25 R2O 0.08 0.08 0.08 RO 19.8  19.8  19.8  MgO/CaO 1.01 0.89 1.00 Value of Expression (I) 4.23 4.19 4.29 Value of Expression (II) 1.12 1.13 1.13 Value of Expression (III) 4.20 4.19 4.24 Average coefficient of (39.8)  (40.0)  (39.6)  thermal expansion (×10⁻⁷/° C.) Density (g/cm³) (2.55) (2.55) (2.56) Strain point (° C.) (707)    (706)    (707)    Glass transition (764)    (763)    (763)    temperature (° C.) Young's modulus (GPa) (90)    (90)    (90)    T₂ (° C.) (1610)     (1610)     (1611)     T₄ (° C.) (1276)     (1276)     (1277)     T_(c) (° C.) (1265)     (1275)     (1285)     T_(d) (° C.) (<1260)     (1265)     (<1280)     η_(c)(dPa · s) (10^(4.10))  (10^(4.01))  (10^(3.94))  η_(d)(dPa · s) (>10^(4.14))  (10^(4.09))  (>10^(3.98))  Specific elastic modulus (35.4)  (35.3)  (35.1)  (MNm/kg) Equivalent cooling rate 40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)    

TABLE 4 Ex22 Ex23 Ex24 Ex25 Ex26 Ex27 Ex28 SiO₂ 64.7  66.6  65.6  65.7  61.9  68.4  64.3  Al₂O₃ 14.2  12.1  12.4  15.9  10.2  11.0  15.5  B₂O₃ 1.2  4   2.7  0.0  0.0  0.0  0   MgO 8.6  7.6  10.9  8.0  14.2  10.0  15.7  CaO 9.4  5.2  8.4  10.4  13.7  10.6  4.5  SrO 1.8  5   0.0  0.0  0.0  0   0   BaO 0   0   0   0   0   0   0   Li₂O 0   0   0   0   0   0   0   Na₂O 0.08 0.03 0.03 0.03 0.03 0.03 0.03 K₂O 0   0   0   0   0   0   0   F 0.13 0.08 0.08 0.08 0.08 0.08 0.08 P₂O₅ 0   0   0   0   0   0   0   SnO₂ 0   0   0   0   0   0   0   β-OH [/mm] 0.25 0.25 0.25 0.25 0.25 0.25 0.25 R₂O 0.08 0.03 0.03 0.03 0.03 0.03 0.03 RO 19.8  17.5  19.4  18.4  27.9  20.6  20.2  MgO/CaO 0.91 1.45 1.30 0.77 1.04 0.95 3.48 Value of Expression (I) 4.26 3.20 3.94 4.41 5.47 4.02 5.17 Value of Expression (II) 1.14 1.46 1.29 0.78 1.43 0.92 0.77 Value of Expression (III) 4.23 4.22 4.71 4.47 5.07 3.80 37.35   Average coefficient of (40.2)  (38)    40.0  — 47.0  (37)    (35)    thermal expansion (×10⁻⁷/° C.) Density (g/cm³) (2.56) (2.56) 2.50 2.54 2.60 (2.55) 2.55 Strain point (° C.) (707)    (698)    (710)    (761)    (704)    (731)    (744)    Glass transition (765)    (763)    761    (811)    764    (800)    (797)    temperature (° C.) Young's modulus (GPa) (90)    (84.6)  89.3  92.2  92.7  (89.7)  95.4  T₂ (° C.) (1610)     (1647)     1615     1629     (1523)     (1612)     (1589)     T₄ (° C.) (1278)     (1297)     1272     1301     (1205)     (1253)     (1268)     T_(c) (° C.) (1275)     — 1350     — 1210     — (>1288)     Td (° C.) (<1270)     — — — — — — η_(c)(dPa · s) (10^(4.02))  — — — — — <10^(3.80)  η_(d)(dPa · s) (>10^(4.06))  Specific elastic modulus (35.0)  (33.0)  35.7  36.3  35.7  (35.2)  37.4  (MNm/kg) Equivalent cooling rate 40    40    40    40    40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)     (≤100)     (≤100)     (≤100)     (≤100)    

TABLE 5 Ex29 Ex30 Ex31 Ex32 SiO₂ 64.4  63.7  63.5  63.9  Al₂O₃ 14.2  14.2  16.0  15.5  B₂O₃ 2.2  2.8  2.2  2.0  MgO 9.5  9.7  9.0  8.0  CaO 7.5  7.9  8.0  8.0  SrO 2.1  1.6  1.3  2.5  BaO 0   0   0   0   Li₂O 0.01 0.01 0   0   Na₂O 0.05 0.05 0.08 0.01 K₂O 0.01 0.01 0   0   F 0.13 0.06 0.06 0.06 P₂O₅ 0   0   0   0.1  SnO₂ 0   0.1  0   0   β-OH [/mm] 0.25 0.25 0.25 0.25 R₂O 0.07 0.07 0.08 0.01 RO 19.1  19.2  18.3  18.5  MgO/CaO 1.27 1.23 1.13 1.00 Value of Expression (I) 4.12 4.13 4.30 4.17 Value of Expression (II) 1.25 1.36 1.18 1.19 Value of Expression (III) 4.61 4.69 4.64 4.28 Average coefficient of 38.7  (38.6)  (37.3)  38.8  thermal expansion (×10⁻⁷/° C.) Density (g/cm³) 2.55 (2.54) (2.55) (2.57) Strain point (° C.) 712    (703)    (719)    (721)    Glass transition 770    (760)    (779)    (782)    temperature (° C.) Young's modulus (GPa) 88.7  (89)    (90)    (89)    T₂ (° C.) 1610     (1592)     (1594)     (1605)     T₄ (° C.) 1268     (1260)     (1269)     (1276)     T_(c) (° C.) 1285     (≤1280)     (≤1289)     (≤1296)     T_(d) (° C.) <1285     (≤1280)     (≤1289)     (≤1296)     η_(c)(dPa · s) 10^(3.87)  (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8))  η_(d)(dPa · s) >10^(3.97)  (≥10^(3.8))  (≥10³ ⁸)  (≥10^(3.8))  Specific elastic modulus 34.8  (35.0)  (35.3)  (34.6)  (MNm/kg) Equivalent cooling rate 40    40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)     (≤100)     Ex33 Ex34 Ex35 SiO₂ 64.2  64.9  64.9  Al₂O₃ 15.5  12.8  12.8  B₂O₃ 1.2  0.5  1.2  MgO 7.5  11.0  10.0  CaO 8.3  9.7  9.0  SrO 3.2  1.0  2.0  BaO 0   0   0   Li₂O 0   0   0   Na₂O 0.08 0.08 0.08 K₂O 0   0   0   F 0.13 0.13 0.13 P₂O₅ 0   0   0   SnO₂ 0   0   0   β-OH [/mm] 0.25 0.25 0.25 R₂O 0.08 0.08 0.08 RO 19    21.7  21.0  MgO/CaO 0.90 1.13 1.11 Value of Expression (I) 4.26 4.56 4.30 Value of Expression (II) 1.12 1.10 1.21 Value of Expression (III) 4.18 4.46 4.26 Average coefficient of 39.8  40.9  41.1  thermal expansion (×10⁻⁷/° C.) Density (g/cm³) 2.59 (2.56) (2.57) Strain point (° C.) 726    (705)    (700)    Glass transition 779    (761)    (756)    temperature (° C.) Young's modulus (GPa) 89.1  (92)    (90)    T₂ (° C.) 1616     (1603)     (1608)     T₄ (° C.) 1278     (1266)     (1268)     T_(c) (° C.) (≤1298)     (≤1286)     (≤1288)     T_(d) (° C.) (≤1298)     (≤1286)     (≤1288)     η_(c)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8)) η_(d)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8)) Specific elastic modulus 34.4  (35.8)  (35.0)  (MNm/kg) Equivalent cooling rate 40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)    

TABLE 6 Ex36 Ex37 Ex38 Ex39 SiO₂ 64.4  64.9  64.7  64.2  Al₂O₃ 12.8  13.0  13.0  13.8  B₂O₃ 1.8  1.5  1.8  0.5  MgO 9.3  9.0  10.0  10.1  CaO 8.6  9.5  8.4  9.3  SrO 3.0  2.0  2.0  2.0  BaO 0   0   0   0   Li₂O 0   0   0   0   Na₂O 0.08 0.08 0.08 0.08 K₂O 0   0   0   0   F 0.13 0.13 0.13 0.13 P₂O₅ 0   0   0   0   SnO₂ 0   0   0   0   β-OH [/mm] 0.25 0.25 0.25 0.32 R₂O 0.08 0.08 0.08 0.08 RO 20.9  20.5  20.4  21.4  MgO/CaO 1.08 0.95 1.19 1.09 Value of Expression (I) 4.17 4.16 4.19 4.61 Value of Expression (II) 1.34 1.25 1.27 1.12 Value of Expression (III) 4.16 4.13 4.40 4.42 Average coefficient of 41.9  41.1  40.3  41.6  thermal expansion (×10⁻⁷/° C.) Density (g/cm³) 2.58 (2.56) 40.6  (2.58) Strain point (° C.) 704    (700)    2.56 (713)    Glass transition 754    (757)    706    (768)    temperature (° C.) Young's modulus (GPa) 87.9  (89)    758    (91)    T₂ (° C.) 1608     (1610)     88.4  (1597)     T₄ (° C.) 1261     (1270)     1611     (1264)     T_(c) (° C.) (≤1281)     (≤1290)     1265     (≤1284)     T_(d) (° C.) (≤1281)     (≤1290)     1265     (≤1284)     η_(c)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  10^(4.00)  (≥10^(3.8))  η_(d)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  (≥10^(4.0))  (≥10^(3.8))  Specific elastic modulus 34.1  (34.7)  (18.7)  (35.3)  (MNm/kg) Equivalent cooling rate 40    40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)     (≤100)     Ex40 Ex41 Ex42 SiO₂ 64.2  65.1  64.9  Al₂O₃ 13.8  13.8  14.5  B₂O₃ 0.5  1.5  1.5  MgO 9.6  9.2  9.1  CaO 8.8  8.2  7.7  SrO 3.0  1.8  2.0  BaO 0   0.3  0.1  Li₂O 0   0   0   Na₂O 0.08 0.08 0.08 K₂O 0   0   0   F 0.13 0.13 0.13 P₂O₅ 0   0   0   SnO₂ 0   0   0.1  β-OH [/mm] 0.32 0.32 0.32 R₂O 0.08 0.08 0.08 RO 21.4  19.5  18.9  MgO/CaO 1.09 1.12 1.18 Value of Expression (I) 4.55 4.12 4.16 Value of Expression (II) 1.15 1.16 1.12 Value of Expression (III) 4.30 4.17 4.34 Average coefficient of 42.3  39.6  38.9  thermal expansion (×10⁻⁷/° C.) Density (g/cm³) (2.60) (2.56) (2.56) Strain point (° C.) (713)    (710)    (712)    Glass transition (769)    (765)    (769)    temperature (° C.) Young's modulus (GPa) (91)    (89)    (89)    T₂ (° C.) (1599)     (1622)     (1624)     T₄ (° C.) (1266)     (1279)     (1282)     T_(c) (° C.) (≤1286)     (≤1299)     (≤1302)     T_(d) (° C.) (≤1286)     (≤1299)     (≤1302)     η_(c)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8))  η_(d)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8))  Specific elastic modulus (35.0)  (34.7)  (34.8)  (MNm/kg) Equivalent cooling rate 40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)    

TABLE 7 Ex43 Ex44 Ex45 Ex46 SiO₂ 62.4  63.5  63.5  65.1  Al₂O₃ 16.0  13.0  13.0  14.0  B₂O₃ 0.7  1.5  1.7  1.2  MgO 11.0  12.1  9.2  8.6  CaO 8.8  9.2  11.2  7.5  SrO 1.0  0.6  1.3  3.5  BaO 0   0   0   0   Li₂O 0   0   0   0   Na₂O 0.08 0.08 0.08 0.08 K₂O 0   0   0   0   F 0.13 0.13 0.13 0.13 P₂O₅ 0   0   0   0   SnO₂ 0   0   0   0   β-OH [/mm] 0.32 0.25 0.25 0.25 R₂O 0.08 0.08 0.08 0.08 RO 20.8  21.9  21.7  19.6  MgO/CaO 1.25 1.32 0.82 1.15 Value of Expression (I) 5.01 4.65 4.39 4.15 Value of Expression (II) 1.08 1.28 1.37 1.15 Value of Expression (III) 5.27 5.21 4.52 4.10 Average coefficient of 39.7  (40.5)  (42.6)  (40.6)  thermal expansion (×10⁻⁷/° C.) Density (g/cm³) (2.57) (2.55) (2.57) (2.58) Strain point (° C.) (715)    (700)    (699)    (712)    Glass transition (773)    (753)    (752)    (769)    temperature (° C.) Young's modulus (GPa) (93)    (91)    (90)    (89)    T₂ (° C.) (1577)     (1573)     (1580)     (1624)     T₄ (° C.) (1255)     (1242)     (1245)     (1283)     T_(c) (° C.) (≤1275)     (≤1262)     (≤1265)     (≤1303)     T_(d) (° C.) (≤1275)     (≤1262)     (≤1265)     (≤1303)     η_(c)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8))  η_(d)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8))  Specific elastic modulus (36.2)  (35.8)  (35.0)  (34.4)  (MNm/kg) Equivalent cooling rate 40    40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)     (≤100)     Ex47 Ex48 Ex49 SiO₂ 64.3  64.5  64.8  Al₂O₃ 15.5  12.8  13.0  B₂O₃ 1.2  1.8  1.8  MgO 7.5  9.3  10.0  CaO 8.3  8.6  8.4  SrO 3.2  3.0  2.0  BaO 0   0   0   Li₂O 0   0   0   Na₂O 0.13 0   0   K₂O 0   0   0   F 0.08 0   0   P₂O₅ 0   0   0   SnO₂ 0   0   0   β—OH [/mm] 0.25 0.25 0.25 R₂O 0.13 0.00 0.00 RO 19.0  20.9  20.4  MgO/CaO 0.90 1.08 1.19 Value of Expression (I) 4.25 4.16 4.18 Value of Expression (II) 1.13 1.32 1.25 Value of Expression (III) 4.17 4.15 4.39 Average coefficient of (40.1)  (42.0)  (40.3)  thermal expansion (×10⁻⁷/° C.) Density (g/cm³) (2.59) (2.58) (2.56) Strain point (° C.) (715)    (710)    (712)    Glass transition (775)    (763)    (765)    temperature (° C.) Young's modulus (GPa) (89.1)  (88.7)  (89.4)  T₂ (° C.) (1613)     (1602)     (1605)     T₄ (° C.) (1282)     (1263)     (1266)     T_(c) (° C.) (≤1302)     (≤1283)     (≤1286)     T_(d) (° C.) (≤1302)     (≤1283)     (≤1286)     η_(c)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8))  η_(d)(dPa · s) (≥10^(3.8))  (≥10^(3.8))  (≥10^(3.8))  Specific elastic modulus (34.3)  (34.4)  (35.0)  (MNm/kg) Equivalent cooling rate 40    40    40    (° C./min) Compaction (ppm) (≤100)     (≤100)     (≤100)    

In Example 23, the Young's modulus was low, which was less than 88 GPa. In Example 24, the glass surface devitrification temperature (T_(c)) was higher than T₄+20° C. In Examples 25, 27 and 28, the strain point was high. In Example 26 in which RO exceeded 22, the average coefficient of thermal expansion was large, exceeding 43 ×10⁻⁷/° C.

Although the present invention has been described in detail with reference to its specific embodiment, it is obvious for those in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention. The present application is based on a Japanese patent application (Japanese Patent Application No. 2018-46854) filed on Mar. 14, 2018, the entire contents of which are introduced by reference. In addition, all the references cited herein are incorporated as a whole.

INDUSTRIAL APPLICABILITY

A glass according to the present invention characterized as described above is suitable for applications such as a substrate for a display, a substrate for a photomask, a substrate for supporting an electronic device, a substrate for an information recording medium, and a substrate for a planar antenna. 

1. A glass having a density of 2.60 g/cm³ or lower, a Young's modulus of 88 GPa or more, a strain point of 650 to 720° C., a temperature T₄ at which a glass viscosity reaches 10⁴ dPa·s of 1,320° C. or lower, a glass surface devitrification temperature (T_(c)) of T₄+20° C. or lower, and an average coefficient of thermal expansion of 30×10⁻⁷ to 43×10⁻⁷/° C. at 50 to 350° C., and comprising, as represented by mol % based on oxides, 50 to 80% of SiO₂, 8 to 20% of Al₂O₃, 0 to 0.5% in total of at least one kind of alkali metal oxide selected from the group consisting of Li₂O, Na₂O and K₂O, and 0 to 1% of P₂O₅.
 2. The glass according to claim 1, having a specific elastic modulus of 34 MN·m/kg or higher.
 3. The glass according to claim 1, having a glass surface devitrification viscosity (η_(c)) of 10^(3.8) dPa·s or higher.
 4. The glass according to claim 1, having a temperature T₂ at which the viscosity reaches 10² dPa·s of 1,680° C. or lower.
 5. The glass according to claim 1, having a glass transition temperature of 730 to 790° C.
 6. The glass according to claim 1, comprising, as represented by mol % based on oxides, 50 to 80% of SiO₂, 8 to 20% of Al₂O₃, 0 to 5% of B₂O₃, 0 to 15% of MgO, 0 to 12% of CaO, 0 to 10% of SrO, 0 to 10% of BaO, 0.005 to 0.2% of Na₂O, 0.001 to 0.5% of F, 0 to 1% of P₂O₅, and 0 to 0.5% in total of at least one kind of alkali metal oxide selected from the group consisting of Li₂O, Na₂O and K₂O, wherein MgO+CaO+SrO+BaO is 18 to 22%.
 7. The glass according to claim 6, comprising, as represented by mol % based on oxides, 0.1 to 15% of MgO, and 1 to 12% of CaO, wherein MgO/CaO is 0.7 to 1.33.
 8. The glass according to claim 1, having a β-OH value of 0.1 to 0.6 mm⁻¹.
 9. The glass according to claim 1, having a value expressed by the following Expression (I) of 4.10 or more: (7.87[Al₂O₃]−8.5[B₂O₃]+11.35[MgO]+7.09[CaO]+5.52[SrO]−1.45[BaO])/[SiO₂]  Expression (I).
 10. The glass according to claim 1, having a value expressed by the following Expression (II) of 0.95 or more: {−1.02[Al₂O₃]+10.79[B₂O₃]+2.84[MgO]+4.12[CaO]+5.19[SrO]+3.16[BaO]+11.07×([Li₂O]+[Na₂O]+[K₂O])+3.954[F]+5.677[β-OH]}/[SiO₂]  Expression (11).
 11. The glass according to claim 1, having a value expressed by the following Expression (III) of 5.5 or less: (8.9[Al₂O₃]+4.26[B₂O₃]+11.3[MgO]+4.54[CaO]+0.1[SrO]−9.98[BaO])×{1+([MgO]/[CaO]−1)²}/[SiO₂]  Expression (III).
 12. The glass according to claim 1, comprising, as represented by mol % based on oxides, 0.5% or less of SnO₂.
 13. The glass according to claim 1, having a compaction of 100 ppm or lower.
 14. The glass according to claim 1, having an equivalent cooling rate of 5 to 500° C./min.
 15. The glass according to claim 1, which is a glass sheet having at least one side of 1,800 mm or longer and a thickness of 0.7 mm or thinner.
 16. The glass according to claim 15, which is manufactured by a float process or a fusion process.
 17. A display panel comprising the glass according to claim
 1. 18. A semiconductor device comprising the glass according to claim
 1. 19. An information recording medium comprising the glass according to claim
 1. 20. A planar antenna comprising the glass according to claim
 1. 